Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-09-12 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2023-07-04 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Meizi Jiao, Chong Zhang, Hongxia Feng | 2023-05-02 |