Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11719978 | Direct-lit backlight units with light-emitting diodes | Zhenyue Luo, Morteza Amoorezaei, Ling Han, Chungjae Lee, Ziruo Hong +7 more | 2023-08-08 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang | 2023-08-08 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Sheng Li, Matthew Tingey, Chung Kwang Christopher Tan | 2023-06-13 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Chong Zhang, Hongxia Feng, Kevin Thomas McCarthy | 2023-05-02 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang | 2023-01-17 |