Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Andrew J. Brown, Kaladhar Radhakrishnan | 2023-11-28 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-08-08 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Ying Wang +2 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng | 2023-07-04 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Kyu Oh Lee, Sheng Li, Yikang Deng | 2023-05-16 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Chong Zhang, Junnan Zhao | 2023-05-09 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee | 2023-01-17 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-01-17 |