Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769719 | Dual trace thickness for single layer routing | Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769719 | Dual trace thickness for single layer routing | Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |