| 11830809 |
Magnetic structures in integrated circuit package supports |
Ying Wang, Yikang Deng, Junnan Zhao, Cheng Xu, Kaladhar Radhakrishnan |
2023-11-28 |
| 11824013 |
Package substrate with reduced interconnect stress |
Lauren A. Link, Sheng Li, Sandeep B. Sane |
2023-11-21 |
| 11804455 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Prithwish Chatterjee |
2023-10-31 |
| 11769719 |
Dual trace thickness for single layer routing |
Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Yikang Deng |
2023-09-26 |
| 11737208 |
Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong |
2023-08-22 |
| 11705389 |
Vias for package substrates |
Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu, Ying Wang +2 more |
2023-07-18 |
| 11670504 |
Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives |
Jeremy Ecton, Brandon C. Marin, Dilan Seneviratne |
2023-06-06 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Rahul Jain, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link |
2023-05-16 |
| 11622448 |
Sandwich-molded cores for high-inductance architectures |
Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton +1 more |
2023-04-04 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li +1 more |
2023-03-21 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |
| 11552008 |
Asymmetric cored integrated circuit package supports |
Lauren A. Link, Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Chong Zhang |
2023-01-10 |
| 11552010 |
Dielectric for high density substrate interconnects |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta |
2023-01-10 |