Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Bai Nie | 2023-12-05 |
| 11784128 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2023-10-10 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2023-09-19 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2023-07-11 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Andrew J. Brown, Kristof Darmawikarta | 2023-01-10 |