Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati | 2023-12-05 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |