Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854834 | Integrated circuit package supports | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Haobo Chen, Changhua Liu, Sri Ranga Sai Boyapati, Bai Nie | 2023-12-05 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Henning Braunisch, Prithwish Chatterjee, Andrew J. Brown | 2023-10-31 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Roy Dittler, Jeremy Ecton, Darko Grujicic | 2023-10-17 |
| 11784128 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2023-10-10 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Veronica Strong, Arnab Sarkar | 2023-08-15 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2023-07-11 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Andrew J. Brown, Sri Ranga Sai Boyapati | 2023-01-10 |