Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Veronica Strong, Kristof Darmawikarta | 2023-08-15 |
| 11676889 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Sujit Sharan, Dae-Woo Kim | 2023-06-13 |