| 11784181 |
Die backend diodes for electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2023-10-10 |
| 11751367 |
Microelectronic package electrostatic discharge (ESD) protection |
Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid |
2023-09-05 |
| 11749628 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more |
2023-09-05 |
| 11728258 |
Electroless metal-defined thin pad first level interconnects for lithographically defined vias |
Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar |
2023-08-15 |
| 11694951 |
Zero-misalignment two-via structures |
Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan |
2023-07-04 |
| 11676918 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov |
2023-06-13 |
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings |
2023-05-30 |
| 11621236 |
Electrostatic discharge protection in integrated circuits using positive temperature coefficient material |
Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
| 11581238 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao |
2023-02-14 |