Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2023-10-10 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2023-09-05 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11728258 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar | 2023-08-15 |
| 11694951 | Zero-misalignment two-via structures | Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan | 2023-07-04 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings | 2023-05-30 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2023-04-04 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Jimin Yao | 2023-02-14 |