Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11694951 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2023-07-04 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Veronica Strong | 2023-05-30 |