Issued Patents 2023
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Feras Eid, Johanna M. Swan, Georgios Dogiamis | 2023-12-12 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11823972 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-11-21 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11791277 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-10-17 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Feras Eid, Veronica Strong, Johanna M. Swan | 2023-10-10 |
| 11769751 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-09-26 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan | 2023-09-19 |
| 11756943 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2023-09-12 |
| 11749642 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2023-09-05 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Feras Eid | 2023-09-05 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2023-09-05 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11728290 | Waveguide fan-out | Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2023-08-08 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11694986 | Vias in composite IC chip structures | Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2023-07-04 |
| 11688665 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-06-27 |
| 11688729 | Integrated thin film capacitors on a glass core substrate | Krishna Bharath, Mathew J. Manusharow | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2023-06-13 |
| 11652264 | Microelectronic assemblies with substrate integrated waveguide | Georgios Dogiamis | 2023-05-16 |
| 11652059 | Composite interposer structure and method of providing same | Shawna M. Lift, Johanna M. Swan, Gerald Pasdast | 2023-05-16 |
| 11621208 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Johanna M. Swan | 2023-04-04 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Veronica Strong, Aleksandar Aleksov, Johanna M. Swan | 2023-04-04 |