| 11842826 |
Additive manufacturing for integrated circuit assembly connector support structures |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2023-12-12 |
| 11830831 |
Semiconductor package including a modular side radiating waveguide launcher |
Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Adel A. Elsherbini, Telesphor Kamgaing +1 more |
2023-11-28 |
| 11830787 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan |
2023-11-28 |
| 11784108 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan |
2023-10-10 |
| 11764452 |
Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity |
Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan |
2023-09-19 |
| 11728290 |
Waveguide fan-out |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch |
2023-08-15 |
| 11721650 |
Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package |
Brandon C. Marin, Aleksandar Aleksov, Jeremy Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman |
2023-08-08 |
| 11716826 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2023-08-01 |
| 11715693 |
Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture |
Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan, Telesphor Kamgaing |
2023-08-01 |
| 11694962 |
Microelectronic package with mold-integrated components |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2023-07-04 |
| 11688660 |
Bridge for radio frequency (RF) multi-chip modules |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2023-06-27 |
| 11658418 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov |
2023-05-23 |
| 11652264 |
Microelectronic assemblies with substrate integrated waveguide |
Adel A. Elsherbini |
2023-05-16 |
| 11641711 |
Microelectronic package with substrate-integrated components |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2023-05-02 |
| 11621192 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2023-04-04 |
| 11605603 |
Microelectronic package with radio frequency (RF) chiplet |
Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan, Shawna M. Liff +1 more |
2023-03-14 |
| 11594801 |
Mmwave dielectric waveguide interconnect topology for automotive applications |
Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Kenneth D. Shoemaker, Adel A. Elsherbini +1 more |
2023-02-28 |
| 11581272 |
Contactless high-frequency interconnect |
Henning Braunisch, Adel A. Elsherbini, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more |
2023-02-14 |
| 11575749 |
Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars |
Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Johanna M. Swan, Telesphor Kamgaing |
2023-02-07 |