Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda +3 more | 2023-11-14 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Jeremy Ecton, Mohammad Mamunur Rahman | 2023-08-08 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Jeremy Ecton, Bai Nie, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |
| 11658055 | Customizable release layers to enable low warpage architectures for advanced packaging applications | Rahul N. Manepalli | 2023-05-23 |
| 11574993 | Package architecture with tunable magnetic properties for embedded devices | Rengarajan Shanmugam, Darko Grujicic, Srinivas V. Pietambaram | 2023-02-07 |