Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Hsin-Wei Wang +3 more | 2023-11-14 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2023-08-08 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Kristof Darmawikarta, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |