Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Leonel Arana +2 more | 2023-08-08 |