HT

Hiroki Tanaka

IN Intel: 3 patents #708 of 4,378Top 20%
Honda Motor Co.: 2 patents #283 of 2,070Top 15%
SH Santa Clara Holdings: 1 patents #1 of 17Top 6%
CH Chuo Hatsujo: 1 patents #1 of 7Top 15%
TO Toto: 1 patents #24 of 96Top 25%
TC Toyo Seikan Co.: 1 patents #6 of 65Top 10%
Canon: 1 patents #1,571 of 3,719Top 45%
TR Tahoe Research: 1 patents #11 of 144Top 8%
FC Furukawa Electric Co.: 1 patents #48 of 156Top 35%
Overall (2023): #4,923 of 537,848Top 1%
13
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11855125 Capacitors with nanoislands on conductive plates Srinivas V. Pietambaram, Brandon C. Marin, Jeremy Ecton, Frank Truong 2023-12-26
11846407 Bare optical fiber manufacturing method Zyunpei Watanabe, Kenichi Suyama, Yoshihiro Arashitani 2023-12-19
11829087 Image forming apparatus with image bearing members having different surface layer thicknesses Satoru Motohashi, Nobuo Oshima, Akihisa Matsukawa, Katsuichi Abe, Takayuki Namiki 2023-11-28
11772676 Driving support device Makoto Katayama, Hirokazu Tokushima, Osamu Ito, Hideo KADOWAKI 2023-10-03
11773631 Cover opening-closing device Toshio Kuwayama, Takashi Tomoto 2023-10-03
11772868 Pouch and pouch manufacturing method Takahiro YASUUMI, Takahiro Kurosawa, Masahiro Takenaka 2023-10-03
11743373 Driving support device Makoto Katayama, Osamu Ito, Hideo KADOWAKI 2023-08-29
11721631 Via structures having tapered profiles for embedded interconnect bridge substrates Jeremy Ecton, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more 2023-08-08
11699648 Electromigration resistant and profile consistent contact arrays Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more 2023-07-11
11661373 Method for recycling solar cell module glass Shigenori Nakano 2023-05-30
11652036 Via-trace structures Jeremy Ecton, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn 2023-05-16
11572682 Flush toilet apparatus Hideaki Kashimura, Kenji Watanabe, Satoshi Takano, Yoshikatsu Adachi, Koichi Motooka +1 more 2023-02-07
11574874 Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Frank Truong +4 more 2023-02-07