Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Steve Cho, Rahul Jain, Tarek A. Ibrahim +4 more | 2023-10-03 | $24,984,000 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Hiroki Tanaka +3 more | 2023-07-11 |