| 11842981 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Ji-Yong Park, Kyu Oh Lee |
2023-12-12 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Tarek A. Ibrahim +4 more |
2023-10-03 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
| 11737208 |
Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong |
2023-08-22 |
| 11664290 |
Package with underfill containment barrier |
Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2023-05-30 |
| 11652071 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton |
2023-05-16 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link |
2023-05-16 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more |
2023-02-14 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu |
2023-01-17 |