| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2023-10-03 |
| 11749585 |
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package |
Yiqun Bai, John C. DECKER, Ziyin Lin |
2023-09-05 |
| 11688634 |
Trenches in wafer level packages for improvements in warpage reliability and thermals |
Yiqun Bai, Ziyin Lin, John C. DECKER, Yan Li |
2023-06-27 |
| 11676876 |
Semiconductor die package with warpage management and process for forming such |
Ziyin Lin, Elizabeth Nofen, Taylor Gaines |
2023-06-13 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more |
2023-05-30 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman |
2023-01-03 |