Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, John C. DECKER, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Yiqun Bai, Ziyin Lin, John C. DECKER, Yan Li | 2023-06-27 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Ziyin Lin, Elizabeth Nofen, Taylor Gaines | 2023-06-13 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2023-05-30 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2023-01-03 |