Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11753498 | Mechanophore-grafted polymers to form stress-responsive thermoset network | Lenore Dai, Aditi Chattopadhyay, Jin Zou, Bonsung Koo | 2023-09-12 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Ziyin Lin, Vipul V. Mehta, Taylor Gaines | 2023-06-13 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | James C. Matayabas, Jr., Yawei Liang, Yiqun Bai | 2023-01-24 |