Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, Vipul V. Mehta, John C. DECKER | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Yiqun Bai, John C. DECKER, Yan Li | 2023-06-27 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Elizabeth Nofen, Vipul V. Mehta, Taylor Gaines | 2023-06-13 |