Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Yawei Liang, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula +1 more | 2023-10-03 |