Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2023-09-12 |
| 11705417 | Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level | Chandra Mohan Jha, Prasad Ramanathan, Jimmin Yao, Mark R. Allen | 2023-07-18 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |