Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11551997 | Thermal management solutions using self-healing polymeric thermal interface materials | Amitesh Saha, Shushan Gong | 2023-01-10 |