| 11854932 |
Package wrap-around heat spreader |
Feras Eid, Je-Young Chang |
2023-12-26 |
| 11837519 |
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk |
Zhimin Wan, Chia-Pin Chiu |
2023-12-05 |
| 11756860 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon |
2023-09-12 |
| 11756856 |
Package architecture including thermoelectric cooler structures |
Krishna Vasanth Valavala, Ravindranath V. Mahajan, Kelly Lofgreen, Weihua Tang |
2023-09-12 |
| 11735552 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Debendra Mallik, Sergio Antonio Chan Arguedas, Jimin Yao |
2023-08-22 |
| 11705417 |
Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level |
Prasad Ramanathan, Xavier Francois Brun, Jimmin Yao, Mark R. Allen |
2023-07-18 |
| 11694942 |
Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management |
Kelly Lofgreen, Krishna Vasanth Valavala |
2023-07-04 |
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Liwei Wang |
2023-06-06 |
| 11664293 |
Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios |
Krishna Vasanth Valavala, Ravindranath V. Mahajan |
2023-05-30 |
| 11658095 |
Bump integrated thermoelectric cooler |
Kelly Lofgreen, Krishna Vasanth Valavala |
2023-05-23 |
| 11626395 |
Thermal spreading management of 3D stacked integrated circuits |
Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan |
2023-04-11 |
| 11587843 |
Thermal bump networks for integrated circuit device assemblies |
Prasad Ramanathan, Nicholas Neal |
2023-02-21 |