| 11824041 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly |
2023-11-21 |
| 11822249 |
Method and apparatus to develop lithographically defined high aspect ratio interconnects |
— |
2023-11-21 |
| 11817423 |
Double-sided substrate with cavities for direct die-to-die interconnect |
— |
2023-11-14 |
| 11774489 |
Multi-member test probe structure |
Justin Huttula |
2023-10-03 |
| 11756860 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun |
2023-09-12 |
| 11639556 |
Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays |
Joe Walczyk, Andrew Hoitink, Tanner Schulz |
2023-05-02 |
| 11626395 |
Thermal spreading management of 3D stacked integrated circuits |
Robert L. Sankman, Weihua Tang, Chandra Mohan Jha, Zhimin Wan |
2023-04-11 |
| 11622466 |
Low force liquid metal interconnect solutions |
Karumbu Meyyappan, Kyle Arrington, David Craig |
2023-04-04 |
| 11581237 |
Cooling apparatuses for microelectronic assemblies |
Joe Walczyk |
2023-02-14 |
| 11543454 |
Double-beam test probe |
Paul Diglio, Karumbu Meyyappan |
2023-01-03 |