Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848253 | Semiconductor structure with an air gap | Ching-Pin Hsu, Chih-Jung Wang, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin | 2023-12-19 |
| 11721772 | Varactor with meander diffusion region | Su Xing | 2023-08-08 |
| 11721757 | Semiconductor device | Chia-Huei Lin, Kuo-Yuh Yang | 2023-08-08 |
| 11715709 | Manufacturing method of radiofrequency device including mold compound layer | Wen-Shen Li, Ching-Yang Wen | 2023-08-01 |
| 11676992 | Inductor module and method for fabricating the same | Su Xing, Shyam Parthasarathy, Xiao Yuan Zhi | 2023-06-13 |
| 11670567 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Ching-Yang Wen, Chee-Hau Ng | 2023-06-06 |
| 11658118 | Transistor structure in low noise amplifier | Chia-Huei Lin, Kuo-Yuh Yang | 2023-05-23 |
| 11658087 | High resistivity wafer with heat dissipation structure and method of making the same | Kuo-Yuh Yang, Chia-Huei Lin | 2023-05-23 |
| 11652017 | High resistivity wafer with heat dissipation structure and method of making the same | Kuo-Yuh Yang, Chia-Huei Lin | 2023-05-16 |
| 11637080 | Method for fabricating an integrated circuit device | Kuo-Yuh Yang, Chia-Huei Lin, Chu-Chun Chang | 2023-04-25 |