Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715709 | Manufacturing method of radiofrequency device including mold compound layer | Purakh Raj Verma, Wen-Shen Li | 2023-08-01 |
| 11670567 | Semiconductor structure and method of wafer bonding | Chia-Liang Liao, Purakh Raj Verma, Chee-Hau Ng | 2023-06-06 |