Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670567 | Semiconductor structure and method of wafer bonding | Purakh Raj Verma, Ching-Yang Wen, Chee-Hau Ng | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670567 | Semiconductor structure and method of wafer bonding | Purakh Raj Verma, Ching-Yang Wen, Chee-Hau Ng | 2023-06-06 |