Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715709 | Manufacturing method of radiofrequency device including mold compound layer | Purakh Raj Verma, Ching-Yang Wen | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715709 | Manufacturing method of radiofrequency device including mold compound layer | Purakh Raj Verma, Ching-Yang Wen | 2023-08-01 |