Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848253 | Semiconductor structure with an air gap | Ching-Pin Hsu, Chih-Jung Wang, Chu-Chun Chang, Chia-Huei Lin, Purakh Raj Verma | 2023-12-19 |
| 11721757 | Semiconductor device | Purakh Raj Verma, Chia-Huei Lin | 2023-08-08 |
| 11658087 | High resistivity wafer with heat dissipation structure and method of making the same | Purakh Raj Verma, Chia-Huei Lin | 2023-05-23 |
| 11658118 | Transistor structure in low noise amplifier | Purakh Raj Verma, Chia-Huei Lin | 2023-05-23 |
| 11652017 | High resistivity wafer with heat dissipation structure and method of making the same | Purakh Raj Verma, Chia-Huei Lin | 2023-05-16 |
| 11637080 | Method for fabricating an integrated circuit device | Purakh Raj Verma, Chia-Huei Lin, Chu-Chun Chang | 2023-04-25 |