Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11656247 | Micro-coaxial wire interconnect architecture | Ronald Michael Kirby, Erkan Acar, Youngseok Oh, Justin Huttula, Mohanraj Prabhugoud | 2023-05-23 |
| 11639556 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Pooya Tadayon, Andrew Hoitink, Tanner Schulz | 2023-05-02 |
| 11592472 | Thermal switch for rapid thermal coupling and decoupling of devices under test | James Hastings, Morten S. Jensen, Todd Coons | 2023-02-28 |
| 11581237 | Cooling apparatuses for microelectronic assemblies | Pooya Tadayon | 2023-02-14 |