Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more | 2023-09-05 |
| 11622466 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, Kyle Arrington, Pooya Tadayon | 2023-04-04 |