Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Johanna M. Swan +3 more | 2023-09-05 |
| 11740282 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Joseph Parks, Ethan Caughey, Ashwin Ashok, Prasanna Thiyagasundaram | 2023-08-29 |