Issued Patents 2023
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis | 2023-12-12 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Shawna M. Liff, Adel A. Elsherbini, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11830787 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2023-11-28 |
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2023-11-21 |
| 11823972 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-11-21 |
| 11791277 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2023-10-17 |
| 11784108 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2023-10-10 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Veronica Strong | 2023-10-10 |
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Sergio Antonio Chan Arguedas, John J. Beatty | 2023-10-03 |
| 11769751 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff | 2023-09-26 |
| 11769734 | Microelectronic assemblies | Aleksandar Aleksov | 2023-09-26 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch | 2023-09-19 |
| 11756943 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2023-09-12 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more | 2023-09-05 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2023-09-05 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2023-09-05 |
| 11749642 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2023-09-05 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more | 2023-08-08 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Telesphor Kamgaing | 2023-08-01 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11694962 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2023-07-04 |
| 11694951 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings | 2023-07-04 |
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2023-07-04 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Telesphor Kamgaing | 2023-06-27 |