Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas | 2023-10-03 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Syadwad Jain, Nachiket R. Raravikar | 2023-05-16 |
| 11652061 | Package-level backside metallization (BSM) | Shenavia S. Howell, Raymond A. Krick, Suzana Prstic | 2023-05-16 |