Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652061 | Package-level backside metallization (BSM) | Shenavia S. Howell, John J. Beatty, Raymond A. Krick | 2023-05-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652061 | Package-level backside metallization (BSM) | Shenavia S. Howell, John J. Beatty, Raymond A. Krick | 2023-05-16 |