Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2023-05-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2023-05-16 |