Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar | 2023-05-16 |