Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain | 2023-05-16 |
| 11626551 | Bonding ultra-dense bump arrays using alignment bumps | Arnold Daguio, Kwong-Hin Henry Choy, Tigran Nshanian, Paul Scott Martin | 2023-04-11 |