| 11854932 |
Package wrap-around heat spreader |
Chandra Mohan Jha, Je-Young Chang |
2023-12-26 |
$39,948,000 |
| 11842826 |
Additive manufacturing for integrated circuit assembly connector support structures |
Adel A. Elsherbini, Johanna M. Swan, Georgios Dogiamis |
2023-12-12 |
$45,136,000 |
| 11830787 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-11-28 |
$31,872,000 |
| 11823972 |
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-11-21 |
$28,968,000 |
| 11791528 |
Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2023-10-17 |
$15,641,000 |
| 11784181 |
Die backend diodes for electrostatic discharge (ESD) protection |
Aleksandar Aleksov, Adel A. Elsherbini, Veronica Strong, Johanna M. Swan |
2023-10-10 |
$20,947,000 |
| 11784108 |
Thermal management in integrated circuit packages |
Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-10-10 |
$20,947,000 |
| 11776869 |
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense |
Johanna M. Swan, Sergio Antonio Chan Arguedas, John J. Beatty |
2023-10-03 |
$24,984,000 |
| 11751367 |
Microelectronic package electrostatic discharge (ESD) protection |
Veronica Strong, Johanna M. Swan, Aleksandar Aleksov, Adel A. Elsherbini |
2023-09-05 |
$19,899,000 |
| 11694962 |
Microelectronic package with mold-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2023-07-04 |
|
| 11688665 |
Thermal management solutions for stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-06-27 |
$18,721,000 |
| 11688660 |
Bridge for radio frequency (RF) multi-chip modules |
Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan |
2023-06-27 |
$18,721,000 |
| 11676918 |
Electrostatic discharge protection in integrated circuits |
Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong |
2023-06-13 |
$22,204,000 |
| 11658418 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov |
2023-05-23 |
$11,397,000 |
| 11652074 |
Semiconductor package with improved thermal blocks |
Johanna M. Swan |
2023-05-16 |
$11,130,000 |
| 11641711 |
Microelectronic package with substrate-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Johanna M. Swan |
2023-05-02 |
$21,235,000 |
| 11621192 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11621236 |
Electrostatic discharge protection in integrated circuits using positive temperature coefficient material |
Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11621208 |
Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices |
Adel A. Elsherbini, Johanna M. Swan |
2023-04-04 |
$21,090,000 |
| 11615998 |
Thermal management solutions for embedded integrated circuit devices |
Johanna M. Swan, Adel A. Elsherbini |
2023-03-28 |
$20,940,000 |
| 11616047 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff |
2023-03-28 |
$20,940,000 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot |
2023-01-10 |
$14,061,000 |
