| 11854945 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund |
2023-12-26 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more |
2023-11-28 |
| 11791274 |
Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects |
Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam +1 more |
2023-10-17 |
| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2023-10-03 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more |
2023-10-03 |
| 11769753 |
Thermally-optimized tunable stack in cavity package-on-package |
George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Tannaz Harirchian +1 more |
2023-09-26 |
| 11735495 |
Active package cooling structures using molded substrate packaging technology |
Omkar G. Karhade, Mitul Modi, Aastha Uppal |
2023-08-22 |
| 11646274 |
Multi-package assemblies having foam structures for warpage control |
Mufei Yu, Gang Duan, Baris Bicen, Rahul N. Manepalli |
2023-05-09 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more |
2023-02-07 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Betsegaw K. Gebrehiwot, Feras Eid |
2023-01-10 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Aastha Uppal +8 more |
2023-01-03 |