Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |