Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| 11804441 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Debendra Mallik | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more | 2023-10-17 |
| 11764080 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2023-09-19 |
| 11735558 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2023-08-22 |
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Mitul Modi, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |