Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804441 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam +1 more | 2023-10-17 |
| 11735558 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2023-08-22 |