Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| 11804456 | Wirebond and leadframe magnetic inductors | William J. Lambert, Martin Rodriguez, Gregorio R. Murtagian | 2023-10-31 |
| 11804441 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more | 2023-10-17 |
| 11764080 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2023-09-19 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Mitul Modi, Edvin Cetegen, Aastha Uppal | 2023-08-22 |
| 11735558 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2023-08-22 |
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Nitin A. Deshpande, Shawna M. Liff, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11616283 | 5G mmWave antenna architecture with thermal management | William J. Lambert, Xiaoqian Li, Sidharth Dalmia | 2023-03-28 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang, Mitul Modi | 2023-03-21 |
| 11581240 | Liquid thermal interface material in electronic packaging | Kedar Dhane, Aravindha R. Antoniswamy, Divya Mani | 2023-02-14 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Ram Viswanath, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2023-01-10 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |