William J. Lambert — 9 Patents at Intel

Issued Patents 2023

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11804456	Wirebond and leadframe magnetic inductors	Omkar G. Karhade, Martin Rodriguez, Gregorio R. Murtagian	2023-10-31	$30,374,000
11804426	Integrated circuit structures in package substrates	Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more	2023-10-31	$30,374,000
11729902	Radio frequency front-end structures	Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar	2023-08-15	$18,845,000
11699630	Thermals for packages with inductors	—	2023-07-11	$21,736,000
11676950	Via-in-via structure for high density package integrated inductor	Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do	2023-06-13	$22,204,000
11664596	Antenna modules and communication devices	Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun	2023-05-30	$16,378,000
11616283	5G mmWave antenna architecture with thermal management	Omkar G. Karhade, Xiaoqian Li, Sidharth Dalmia	2023-03-28	$20,940,000
11608564	Helical plated through-hole package inductor	Mihir K. Roy, Mathew J. Manusharow, Yikang Deng	2023-03-21	$20,076,000
11611164	Wideband multi-pin edge connector for radio frequency front end module	Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, Zhichao Zhang, Mitul Modi	2023-03-21	$20,076,000