| 11804456 |
Wirebond and leadframe magnetic inductors |
Omkar G. Karhade, Martin Rodriguez, Gregorio R. Murtagian |
2023-10-31 |
| 11804426 |
Integrated circuit structures in package substrates |
Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more |
2023-10-31 |
| 11729902 |
Radio frequency front-end structures |
Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar |
2023-08-15 |
| 11699630 |
Thermals for packages with inductors |
— |
2023-07-11 |
| 11676950 |
Via-in-via structure for high density package integrated inductor |
Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do |
2023-06-13 |
| 11664596 |
Antenna modules and communication devices |
Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun |
2023-05-30 |
| 11616283 |
5G mmWave antenna architecture with thermal management |
Omkar G. Karhade, Xiaoqian Li, Sidharth Dalmia |
2023-03-28 |
| 11608564 |
Helical plated through-hole package inductor |
Mihir K. Roy, Mathew J. Manusharow, Yikang Deng |
2023-03-21 |
| 11611164 |
Wideband multi-pin edge connector for radio frequency front end module |
Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, Zhichao Zhang, Mitul Modi |
2023-03-21 |