Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804456 | Wirebond and leadframe magnetic inductors | Omkar G. Karhade, Martin Rodriguez, Gregorio R. Murtagian | 2023-10-31 |
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11729902 | Radio frequency front-end structures | Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar | 2023-08-15 |
| 11699630 | Thermals for packages with inductors | — | 2023-07-11 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do | 2023-06-13 |
| 11664596 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun | 2023-05-30 |
| 11616283 | 5G mmWave antenna architecture with thermal management | Omkar G. Karhade, Xiaoqian Li, Sidharth Dalmia | 2023-03-28 |
| 11608564 | Helical plated through-hole package inductor | Mihir K. Roy, Mathew J. Manusharow, Yikang Deng | 2023-03-21 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, Zhichao Zhang, Mitul Modi | 2023-03-21 |