Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more | 2023-10-31 |
| 11729902 | Radio frequency front-end structures | Sidharth Dalmia, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar | 2023-08-15 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang, Mitul Modi | 2023-03-21 |