Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11764150 | Inductors for package substrates | Tarek A. Ibrahim, Wei-Lun Kane Jen | 2023-09-19 |
| 11721632 | Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its making | — | 2023-08-08 |
| 11664313 | Microelectronic device including fiber-containing build-up layers | — | 2023-05-30 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11631595 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2023-04-18 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, William J. Lambert, Zhichao Zhang, Mitul Modi | 2023-03-21 |